Probe Card Design
Two-site probe card design with schematic development and an 18-layer PCB layout for semiconductor test applications.
These projects show ST Solutions’ ability to move from problem investigation to design, manufacturing coordination, firmware, software, assembly, wiring, and final test.
Two-site probe card design with schematic development and an 18-layer PCB layout for semiconductor test applications.
Configurable production test station supporting multiple products, supply voltages, load requirements, and measurement channels.
Six-unit simultaneous lifetime test system with high-current capability, CAN communication, and climate chamber control.
Rack-mountable custom RF switch for single-site and dual-site test configurations up to 18 GHz.
Schematic, PCB layout, and 3D board-level design for a compact IoT module.
Complete enclosure design, fabrication support, assembly, wiring, and final system integration.
Complete electrical, PCB, firmware, software, wiring, mechanical integration, and system development for a high-throughput test station.
Robotic-arm based haptic measurement platform combining control, measurement, software, and mechanical integration.
Multi-oven monitoring system for temperature, N2 flow, door-state logging, deviation alarms, and SMS notification.
PCBA realization and 3D verification for a high-density probe-card design.
Six-unit simultaneous HCU lifetime test platform with current and voltage measurement and environmental control.
RF box developed for low-noise amplifier test applications, combining RF I/O, control interfaces, and embedded hardware in a compact test-ready unit.
Single-unit validation tester with complete test software, a universal interface module, and very high test coverage.
Custom load-board development for National Instruments (now part of Emerson) Semiconductor Test System applications.
Custom load board for 20-site parallel optical sensor test and validation workflows.
Customer-specific multiplexer and relay-board development for optical sensor testing.
Four-layer, eight-site MEMS microphone load board with eight-channel speaker amplification and instrument support.
Rack assembly, system wiring, and hardware integration for production-ready equipment.
Mechanical drawing, 3D modeling, and part-ready bracket design for system integration.
Selected customers & partners
A proven track record across demanding technical organizations and engineering environments.
